In the present study chelating anion exchange resin Dowex M-4195 was used for removing Cu (II) from electroplating waste water. Adsorption was carried out in a batch process with different concentrations of Cu (II) ions by varying pH and agitation time. The uptake of the metal ion was very fast initially, but gradually slowed down in dicating penetration in to the interior of the adsorbent particles. The experimental data closely followed both Langmuir and Freundlich isotherms. A small amount of the adsorbent (1.2 g/L) could remove maximum 87 % of Cu (II) in 300 min from a solution of concentration 100 mg/L at 300 K. The highest adsorption was shown at pH 4.0 and then decreased.